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The scope of this Document covers cyclopentanone which is used in the semiconductor industry
and Availability of Equipment
A gas conforming to the specifications will commonly contain more of the major component than the minimum permissible limit or contain less of an impurity (or several impurities) than the SEMI C3 maximum permissible limit
originally published August 2011
3D01600 - SEMI 3D16 - Specification for Glass Base Material for Semiconductor Packaging StdPbc-0317 The scope of this DocumentThis Specification is intended to address the needs of the 3D Stacked IC (3DS IC) industry by providing the tools needed to procure glass as base material to be used in a 3DS IC process or in similar applications. Such glass may be specified with or without openings for through glass vias (TGV) or blind vias (BV). This Specification describes dimensional and thermal characteristics of glass base material for interposers, RF devices, and other similar
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